{"id":7073,"date":"2026-10-11T11:25:00","date_gmt":"2026-10-11T08:25:00","guid":{"rendered":"https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/?p=7073"},"modified":"2026-10-11T11:25:00","modified_gmt":"2026-10-11T08:25:00","slug":"computer-engineering-department-students-participate-in-hitex-2026-erbil","status":"publish","type":"post","link":"https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/computer-engineering-department-students-participate-in-hitex-2026-erbil\/","title":{"rendered":"Computer Engineering Department Students Participate in HITEX 2026 \u2013 Erbil"},"content":{"rendered":"<div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:1331.2px;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:0px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1\"><p>On October 7, 2026, students from the Computer Engineering Department at Tishk International University traveled to Erbil to attend HITEX 2026 at the Erbil International Fairground. The event showcased innovation, technology, and investment opportunities in the Kurdistan Region. This visit provided students with valuable exposure to emerging trends and practical applications of technology across various sectors.<\/p>\n<div>\n<p>Throughout the event, students had the opportunity to explore a wide range of exhibitions, engage with industry professionals, and gain insights into the latest technological solutions and digital transformation initiatives. The experience allowed them to connect theoretical knowledge acquired in the classroom with real-world innovations, broadening their perspective on the rapidly evolving technology landscape.<\/p>\n<p>The trip also encouraged students to develop a deeper understanding of the relationship between technological advancement, entrepreneurship, and economic development. By observing successful projects, innovative products, and collaborative initiatives presented at the exhibition, participants were inspired to think creatively about future opportunities within the technology sector.<\/p>\n<p>This educational visit reflects the Computer Engineering Department\u2019s commitment to providing students with practical learning experiences that complement academic studies. Such activities help prepare future engineers to meet industry demands, foster innovation, and contribute effectively to the technological progress of their communities and beyond.<\/p>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-2 fusion-flex-container has-pattern-background has-mask-background nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:1331.2px;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_6 1_6 fusion-flex-column\" 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src=\"https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex.png\" width=\"950\" height=\"581\" class=\"wp-image-7074\" srcset=\"https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex-200x122.png 200w, https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex-400x245.png 400w, https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex-600x367.png 600w, https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex-800x489.png 800w, https:\/\/sul.tiu.edu.iq\/engineering\/computereng\/wp-content\/uploads\/2026\/10\/Hitex.png 950w\" sizes=\"(max-width: 1024px) 100vw, (max-width: 640px) 100vw, 950px\" \/><\/span><\/li><\/ul><\/div><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-3 fusion_builder_column_1_6 1_6 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:16.666666666667%;--awb-margin-top-large:10px;--awb-spacing-right-large:11.52%;--awb-margin-bottom-large:10px;--awb-spacing-left-large:11.52%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":95,"featured_media":7074,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[191],"tags":[],"class_list":["post-7073","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-university-news"],"yoast_head":"<!-- This site is optimized with 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